JPH073662Y2 - 電気回路基板 - Google Patents
電気回路基板Info
- Publication number
- JPH073662Y2 JPH073662Y2 JP1989054844U JP5484489U JPH073662Y2 JP H073662 Y2 JPH073662 Y2 JP H073662Y2 JP 1989054844 U JP1989054844 U JP 1989054844U JP 5484489 U JP5484489 U JP 5484489U JP H073662 Y2 JPH073662 Y2 JP H073662Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact electrode
- conductive paint
- copper foil
- paint layer
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000003973 paint Substances 0.000 claims description 40
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 33
- 239000011889 copper foil Substances 0.000 claims description 31
- 238000005259 measurement Methods 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- 239000010410 layer Substances 0.000 description 34
- 229910000679 solder Inorganic materials 0.000 description 18
- 238000000034 method Methods 0.000 description 10
- 238000005476 soldering Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- 239000006071 cream Substances 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 239000003963 antioxidant agent Substances 0.000 description 3
- 230000003078 antioxidant effect Effects 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- -1 alkyl imidazole Chemical compound 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 230000003064 anti-oxidating effect Effects 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Contacts (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989054844U JPH073662Y2 (ja) | 1989-05-12 | 1989-05-12 | 電気回路基板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989054844U JPH073662Y2 (ja) | 1989-05-12 | 1989-05-12 | 電気回路基板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02146864U JPH02146864U (en]) | 1990-12-13 |
| JPH073662Y2 true JPH073662Y2 (ja) | 1995-01-30 |
Family
ID=31577268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989054844U Expired - Lifetime JPH073662Y2 (ja) | 1989-05-12 | 1989-05-12 | 電気回路基板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH073662Y2 (en]) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63273U (en]) * | 1986-06-18 | 1988-01-05 | ||
| JPS6388714A (ja) * | 1986-10-02 | 1988-04-19 | 信越ポリマ−株式会社 | 印刷配線板 |
| JPS63153571U (en]) * | 1987-03-30 | 1988-10-07 | ||
| JPH02102761U (en]) * | 1989-01-31 | 1990-08-15 |
-
1989
- 1989-05-12 JP JP1989054844U patent/JPH073662Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02146864U (en]) | 1990-12-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH073662Y2 (ja) | 電気回路基板 | |
| US3710195A (en) | Printed circuit board having a thermally insulated resistor | |
| JPH0624970Y2 (ja) | 巻線部品用ドラムコア | |
| JP2646688B2 (ja) | 電子部品の半田付け方法 | |
| JPH06120071A (ja) | チップ部品 | |
| JPH01290293A (ja) | 半田付け装置 | |
| KR100370683B1 (ko) | 전자회로유닛의 프린트기판에 대한 설치구조 및 전자회로유닛의 프린트기판에 대한 설치방법 | |
| JPH01312892A (ja) | 回路基板の製造方法 | |
| JP2864705B2 (ja) | Ｔａｂ用フイルムキャリアテープ及びそのリードへのはんだ被覆方法 | |
| JPH04148587A (ja) | 表面実装用部品の実装方法 | |
| JPH0629152U (ja) | 面実装用電子部品 | |
| JPH03229486A (ja) | 印刷配線板 | |
| JPS6231190A (ja) | 電子回路基板及びその製造方法 | |
| JPH0547442Y2 (en]) | ||
| KR920004037B1 (ko) | 인쇄회로기판의 페인팅방법 | |
| JPH04373156A (ja) | クリーム半田接続方法 | |
| JPH0730238A (ja) | チップ部品の半田付け方法およびチップ部品の搭載構造 | |
| JPH0629640A (ja) | 円筒形チップ部品の取付け構造 | |
| JPS587076B2 (ja) | アツマクカイロバンノセイゾウホウ | |
| JPH04313294A (ja) | プリント配線板のハンダ付け方法 | |
| JPH0686372U (ja) | ハンダ付け用ランド | |
| JPH0575005A (ja) | 電子部品 | |
| JPH0567050U (ja) | 配線基板装置 | |
| JP2000173805A (ja) | ヒューズ付き抵抗器とその製造方法 | |
| JPH09283903A (ja) | プリント配線板の実装方法 |